Thursday, March 14, 2019
Wednesday, December 19, 2018
Wednesday, September 26, 2018
Saturday, April 14, 2018
Thursday, March 2, 2017
Etch Rates for Micromachining Processing
When designing a microfabrication process, the etch rate of each material to be etched must be known. Knowing the etch rates of other materials that will be exposed to the etch, such as masking films and underlying layers, enables an etch process to be chosen for good selectivity (high ratio of etch rate of the target material to etch rate of the other material)—if one exists. These two papers compare the etch rates of different materials in various etchants
K. R. Williams and R. S. Muller, "Etch rates for micromachining processing," in Journal of Microelectromechanical Systems, vol. 5, no. 4, pp. 256-269, Dec 1996.
K. R. Williams, K. Gupta and M. Wasilik, "Etch rates for micromachining processing-Part II," in Journal of Microelectromechanical Systems, vol. 12, no. 6, pp. 761-778, Dec. 2003.
doi: 10.1109/JMEMS.2003.820936
doi: 10.1109/JMEMS.2003.820936
Sunday, February 12, 2017
2D thermal MEMS accelerometer
A 2D thermal MEMS accelerometer uses a monolithic approach that integrates the sensor and
electronics onto the IC which is then hermetically sealed in a package. The silicon die includes a
heating element and thermopiles suspended over a cavity etched into the die. Instead of using
capacitance to measure force, the thermal sensor uses the movement of the heated gas molecules
to detect acceleration. With acceleration, the heated molecules move in the direction of
acceleration, and with zero acceleration the heated gas is symmetrical above the heater. These
devices have no flexing or moving parts, which make them more durable and delivers very high
measurement repeatability.
Saturday, February 11, 2017
SiliconMicromachined Pressure Sensors - a Review
Silicon micromachining for realizing micro mechanical structures has received
considerable interest due to the several advantages of this technology over the conventional
machining techniques. Silicon pressure sensors were the first micro mechanical transducers
developed. Since then the market for micromachined pressure sensors has grown in leaps and
bounds and found application in all walks of life including defense and space applications. The
relevant micromachining technology and the design considerations are reviewed in this paper.
The paper also gives the latest developments in this area and gives the details of the polysilicon
piezoresistor based pressure sensors with Silicon On Insulator (SOI) approach for integrating
pressure sensor and associated electronics.
Prof. K.N. Bhat, IISC Bangalore
SiliconMicromachined Pressure Sensors
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