2D thermal MEMS accelerometer

A 2D thermal MEMS accelerometer uses a monolithic approach that integrates the sensor and electronics onto the IC which is then hermetically sealed in a package. The silicon die includes a heating element and thermopiles suspended over a cavity etched into the die. Instead of using capacitance to measure force, the thermal sensor uses the movement of the heated gas molecules to detect acceleration. With acceleration, the heated molecules move in the direction of acceleration, and with zero acceleration the heated gas is symmetrical above the heater. These devices have no flexing or moving parts, which make them more durable and delivers very high measurement repeatability.

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SiliconMicromachined Pressure Sensors - a Review

Silicon micromachining for realizing micro mechanical structures has received considerable interest due to the several advantages of this technology over the conventional machining techniques. Silicon pressure sensors were the first micro mechanical transducers developed. Since then the market for micromachined pressure sensors has grown in leaps and bounds and found application in all walks of life including defense and space applications. The relevant micromachining technology and the design considerations are reviewed in this paper. The paper also gives the latest developments in this area and gives the details of the polysilicon piezoresistor based pressure sensors with Silicon On Insulator (SOI) approach for integrating pressure sensor and associated electronics.

Prof. K.N. Bhat, IISC Bangalore

SiliconMicromachined Pressure Sensors

MEMS actuators and sensors: observations on their performance and selection for purpose

D J Bell, T J Lu, N A Fleck and S M Spearing

This paper presents an exercise in comparing the performance of microelectromechanical systems (MEMS) actuators and sensors as a function of operating principle. Data have been obtained from the literature for the mechanical performance characteristics of actuators, force sensors and displacement sensors. On-chip and off-chip actuators and sensors are each sub-grouped into families, classes and members according to their principle of operation. The performance of MEMS sharing common operating principles is compared with each other and with equivalent macroscopic devices. The data are used to construct performance maps showing the capability of existing actuators and sensors in terms of maximum force and displacement capability, resolution and frequency. These can also be used as a preliminary design tool, as shown in a case study on the design of an on-chip tensile test machine for materials in thin-film form.

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MEMS actuators and sensors: observations on their performance and selection for purpose

Young's modulus of Silicon

The value of the Young's modulus of silicon is often required for engineering designs using micro-electro-mechanical systems (MEMS) technology. However, silicon is an anisotropic crystalline material and so the answer to the question, "What is the Young's modulus of silicon?" is, "it depends, and it can vary by up to 45%". Fortunately, it is straightforward to determine the correct answer for any situation. A condensed answer to the question and explanation is given here.

http://silicon.mhopeng.ml1.net/Silicon/

This pdf file below shows how to calculate the Young's modulus and Poisson ratio based on the Stiffness matrix

http://www.kaajakari.net/~ville/research/tutorials/elasticity_tutorial.pdf

Electronic archive: Semiconductor Material - Characteristics and Properties

Electronic archive:New Semiconductor Materials - Characteristics and Properties

Microvalves and Micropumps for BioMEMS: Review

Microvalves and Micropumps for BioMEMS: Review

DMQ’s silQflo® Silicon Servo Valve (SSV) - MEMS-based microvalve

DMQ’s silQflo® Silicon Servo Valve (SSV) - MEMS-based microvalve